Patent Assignment
Reel/Frame 050436/0361
Assignment of Assignor's Interest
Recorded: 2019-09-19
Pages: 4
Assignor
IN-DEPTH TEST LLC
Executed: 2019-09-12
Assignee
ID IMAGE SENSING LLC
4 PARK PLAZA, SUITE 550, IRVINE, CALIFORNIA, 92614
Covered Properties
(2)
Column Ball Grid Array Package
Patent:
6,391,687 →
Application:
09/703,474 →
Semiconductor Die Package Including Carrier with Mask and Semiconductor Die
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement
Sep 19, 2016
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 040075/0644 →
Assignment of Assignor's Interest
Sep 11, 2018
From: NOQUIL, JONATHAN A.; ESTACIO, MARIA CRISTINA B.
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 046837/0874 →
Partial Release of Security Interest in Patents Recorded at Reel 038620 Frame 0087 REEL040075 Frame 0644 Reel 046410 Frame 0933 Reel 046530 Frame 0460
Sep 18, 2018
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 047103/0575 →
Release of Security Interest in Patents Recorded at Reel 040075, Frame 0644
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0536 →