Patent Assignment
Reel/Frame 050456/0914
Assignment of Assignor's Interest
Recorded: 2019-09-23
Pages: 4
Assignors
HARTMAN, RICHARD M
Executed: 2019-09-05
MACIOCE, PAUL J
Executed: 2019-09-05
TAIT, ROBERT W
Executed: 2019-09-05
RANSFORD, GEORGE H
Executed: 2019-09-05
Assignee
BOYD CORPORATION
600 SOUTH MCCLURE ROAD, MODESTO, CALIFORNIA, 95357
Covered Property
(1)
Densified Foam for Thermal Insulation in Electronic Devices
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.