IP Library › Assignment 050500/0416
Patent Assignment
Reel/Frame 050500/0416

Assignment of Assignor's Interest

Recorded: 2019-09-26 Pages: 3
Assignors
SUGAUCHI, YASUFUMI
Executed: 2016-03-28
HORIYAMA, JUNGO
Executed: 2016-03-28
MOROHASHI, HIDETOSHI
Executed: 2016-03-28
Assignee
MORIROKU TECNOLOGY COMPANY, LTD.
1-1-1, MINAMIAOYAMA, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Method for Manufacturing Hollow Molded Article and Apparatus for Molding Hollow Molded Article
Application: 16/454,912 →
Publication: US 2019/0315044
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 30, 2025
From: MORIROKU HOLDINGS COMPANY., LTD.
To: MORIROKU CO., LTD.
Reel/Frame 073397/0915 →
Company Split Oct 30, 2025
From: MORIROKU TECHNOLOGY COMPANY, LTD.
To: MORIROKU HOLDINGS COMPANY., LTD.
Reel/Frame 073407/0124 →