IP Library Assignment 050564/0465
Patent Assignment
Reel/Frame 050564/0465

Assignment of Assignor's Interest

Recorded: 2019-09-30 Pages: 3
Assignor
SIEMENS CORPORATION
Executed: 2019-08-12
Assignee
SIEMENS AKTIENGESELLSCHAFT
WERNER-VON-SIEMENS-STRASSE 1, MÜNCHEN, 80333, GERMANY
Covered Property (1)
Identification and Redesign of Critical Thin Segments Below 3D Printer Resolution
Application: 16/471,965 →
Publication: US 2020/0098195
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 30, 2019
From: JAISWAL, PRAKHAR; MUSUVATHY, SURAJ RAVI; ARISOY, ERHAN
To: SIEMENS CORPORATION
Reel/Frame 050563/0895 →
Assignment of Assignor's Interest Sep 30, 2019
From: MADELEY, DAVID
To: SIEMENS INDUSTRY SOFTWARE LIMITED
Reel/Frame 050564/0722 →
Assignment of Assignor's Interest Sep 30, 2019
From: SIEMENS INDUSTRY SOFTWARE LIMITED
To: SIEMENS PRODUCT LIFECYCLE MANAGEMENT SOFTWARE INC.
Reel/Frame 050565/0767 →
Assignment of Assignor's Interest Sep 30, 2019
From: SIEMENS AKTIENGESELLSCHAFT
To: SIEMENS PRODUCT LIFECYCLE MANAGEMENT SOFTWARE INC.
Reel/Frame 050565/0984 →
Change of Name Dec 3, 2019
From: SIEMENS PRODUCT LIFECYCLE MANAGEMENT SOFTWARE INC.
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 051171/0024 →