IP Library › Assignment 050674/0205
Patent Assignment
Reel/Frame 050674/0205

Assignment of Assignor's Interest

Recorded: 2019-10-09 Pages: 7
Assignors
CHOI, SEUNG HYUK
Executed: 2017-03-24
HONG, HYUN JUN
Executed: 2017-03-24
KIM, TAE WOOK
Executed: 2017-03-24
RYU, CHEONG HO
Executed: 2017-03-24
KIM, YOUNG SANG
Executed: 2017-03-24
KIM, SUNG JUN
Executed: 2017-03-24
Assignee
ETHERTRONICS, INC.
5501 OBERLIN DRIVE, SUITE 100, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
Method for Manufacturing a Circuit Having a Lamination Layer Using Laser Direct Structuring Process
Application: 16/596,908 →
Publication: US 2020/0045827
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 2, 2023
From: ETHERTRONICS, INC.
To: AVX ANTENNA, INC.
Reel/Frame 063504/0692 →
Change of Name May 4, 2023
From: AVX ANTENNA, INC.
To: KYOCERA AVX COMPONENTS (SAN DIEGO), INC.
Reel/Frame 063543/0302 →