IP Library › Assignment 050675/0409
Patent Assignment
Reel/Frame 050675/0409

Assignment of Assignor's Interest

Recorded: 2019-10-10 Pages: 11
Assignor
Assignee
COOKSON ELECTRONICS ASSEMBLY MATERIALS GROUP ALPHA
300 ATRIUM DRIVE, SOMERSET, NEW JERSEY, 08873
Covered Property (1)
Soldering material based on sn ag and cu
Application: 10/554,274 →
Publication: US 2007/0036671
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 12, 2019
From: COOKSON ELECTRONICS ASSEMBLY MATERIALS GROUP ALPHA
To: ALPHA METALS INC
Reel/Frame 050984/0174 →
Change of Name Nov 12, 2019
From: ALPHA METALS, INC.
To: ALPHA ASSEMBLY SOLUTIONS INC.
Reel/Frame 050991/0597 →
Assignment of Assignor's Interest Jan 24, 2023
From: HENKEL AG & CO. KGAA
To: HARIMA CHEMICALS GROUP, INC.
Reel/Frame 062467/0399 →