IP Library › Assignment 050772/0098
Patent Assignment
Reel/Frame 050772/0098

Assignment of Assignor's Interest

Recorded: 2019-10-21 Pages: 26
Assignor
REID, J. ROBERT
Executed: 2019-06-11
Assignee
CUBIC CORPORATION
9333 BALBOA AVENUE, SAN DIEGO, CALIFORNIA, 92123
Covered Property (1)
Integrated Chip Scale Packages
Application: 16/433,539 →
Publication: US 2019/0287869
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 2, 2019
From: REID, J. ROBERT
To: CUBIC CORPORATION
Reel/Frame 051852/0533 →
First Lien Security Agreement May 26, 2021
From: CUBIC CORPORATION; PIXIA CORP.; NUVOTRONICS, INC.
To: BARCLAYS BANK PLC
Reel/Frame 056393/0281 →
Second Lien Security Agreement May 26, 2021
From: CUBIC CORPORATION; PIXIA CORP.; NUVOTRONICS, INC.
To: ALTER DOMUS (US) LLC
Reel/Frame 056393/0314 →
Release of Security Interest at Reel/Frame 056393/0281 Jul 28, 2025
From: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
To: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL SOLUTIONS LLC (FORMERLY PIXIA CORP.)
Reel/Frame 072282/0124 →
Release of Security Interest Jul 30, 2025
From: ALTER DOMUS (US) LLC
To: CUBIC CORPORATION; CUBIC DIGITAL SOLUTIONS LLC; NUVOTRONICS, INC.
Reel/Frame 072281/0176 →