IP Library Assignment 050784/0607
Patent Assignment
Reel/Frame 050784/0607

Assignment of Assignor's Interest

Recorded: 2019-10-22 Pages: 6
Assignors
ZHANG, KAI
Executed: 2015-09-17
SURYAVANSHI, ABHIJIT
Executed: 2015-09-16
HIRSCH, ALEXANDER
Executed: 2015-09-16
ZHANG, HUI
Executed: 2015-09-16
Assignee
DIAMOND INNOVATIONS, INC.
6325 HUNTLEY ROAD, WORTHINGTON, OHIO, 43085
Covered Property (1)
Substrates for Polycrystalline Diamond Cutters with Unique Properties
Application: 15/514,371 →
Publication: US 2017/0297172
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
First Lien Patent Security Agreement Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0415 →
Second Lien Patent Security Agreement Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0472 →
Security Interest Aug 31, 2021
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 057388/0971 →
2L Patent Security Release Agreement Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057650/0602 →
1L Patent Security Release Agreement Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057651/0040 →