Patent Assignment
Reel/Frame 050793/0175
Assignment of Assignor's Interest
Recorded: 2019-10-22
Pages: 6
Assignors
SIMMONS, REED
Executed: 2014-04-25
MINAKAWA, TATSUYA
Executed: 2014-04-16
CORLISS, MICHAEL
Executed: 2014-04-16
SWAN, ALAN
Executed: 2014-04-15
ZENNER, NICK
Executed: 2014-04-28
FANUCCI, EMILY
Executed: 2014-04-25
Assignee
MICRONICS, INC.
8463 154TH AVENUE NE, REDMOND, WASHINGTON, 98052
Covered Property
(1)
Methods and Apparatus for Lamination of Rigid Substrates by Sequential Application of Vacuum and Mechanical Force
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.