Patent Assignment
Reel/Frame 050797/0093
Assignment of Assignor's Interest
Recorded: 2019-10-23
Pages: 8
Assignors
KUNDU, AMIT
Executed: 2016-12-20
HU, CHIA-HSIN
Executed: 2017-01-03
HORNG, JAW-JUINN
Executed: 2016-12-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Temperature Compensation Circuits