Patent Assignment
Reel/Frame 050898/0966
Assignment of Assignor's Interest
Recorded: 2019-11-04
Pages: 3
Assignors
ZHU, YONG
Executed: 2019-09-09
LEE, CHEUK YIN
Executed: 2019-09-09
LIU, CHENMIN
Executed: 2019-09-09
LU, SHENGBO
Executed: 2019-09-06
Assignee
NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
UNITS 515-517, 5/F, LAKESIDE 1, NO. 8 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK, SHATIN, NEW TERRITORIES, HONG KONG, HONG KONG
Covered Property
(1)
Electronically-Activated, Self-Molding and Re-Shapeable Load-Bearing Support Structure System and Methods for Molding Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.