Patent Assignment
Reel/Frame 050960/0634
Assignment of Assignor's Interest
Recorded: 2019-11-08
Pages: 5
Assignors
CHENG, CHUNG-LIANG
Executed: 2019-08-07
CHANG, I-MING
Executed: 2019-08-07
CHANG, HSIANG-PI
Executed: 2019-08-07
TSAU, HSUEH-WEN
Executed: 2019-08-07
FANG, ZIWEI
Executed: 2019-09-18
CHAO, HUANG-LIN
Executed: 2019-08-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Device Structure