Patent Assignment
Reel/Frame 050962/0078
Assignment of Assignor's Interest
Recorded: 2019-11-08
Pages: 3
Assignors
TSAI, YI HENG
Executed: 2019-10-07
HUANG, FU-CHUN
Executed: 2019-10-07
LIN, CHING-HUI
Executed: 2019-10-07
CHENG, CHUN-REN
Executed: 2019-10-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Hybrid Ultrasonic Transducer and Method of Forming the Same