Patent Assignment
Reel/Frame 050987/0955
Assignment of Assignor's Interest
Recorded: 2019-11-13
Pages: 5
Assignors
WU, CHIH-WEI
Executed: 2019-10-08
YU, CHEN-HUA
Executed: 2019-10-08
YEE, KUO-CHUNG
Executed: 2019-10-08
LU, SZU-WEI
Executed: 2019-10-08
SHIH, YING-CHING
Executed: 2019-10-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package and Method of Manufacturing the Same