Patent Assignment
Reel/Frame 051015/0284
Assignment of Assignor's Interest
Recorded: 2019-11-15
Pages: 5
Assignors
OSTHOLT, ROMAN
Executed: 2019-09-23
AMBROSIUS, NORBERT
Executed: 2019-09-19
DUNKER, DANIEL
Executed: 2019-09-19
SCHNOOR, ARNE
Executed: 2019-09-19
Assignee
LPKF LASER & ELECTRONICS AG
OSTERIEDE 7, GARBSEN, 30827, GERMANY
Covered Property
(1)
Method for Processing, in Particular Separating, a Substrate by Means of Laser-Induced Deep Reactive Etching