Patent Assignment
Reel/Frame 051023/0235
Assignment of Assignor's Interest
Recorded: 2019-11-15
Pages: 7
Assignors
JEONG, CHAN HEE
Executed: 2019-11-04
SEO, HYUN KI
Executed: 2019-11-04
LEE, JOO HYUNG
Executed: 2019-11-04
LIM, JAE GIL
Executed: 2019-11-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package, Buffer Wafer for Semiconductor Package, and Method of Manufacturing Semiconductor Package