Patent Assignment
Reel/Frame 051137/0254
Assignment of Assignor's Interest
Recorded: 2019-11-29
Pages: 6
Assignors
CHEN, WEI-CHIH
Executed: 2019-10-31
LEE, CHIEN-HSUN
Executed: 2019-10-31
LIU, CHUNG-SHI
Executed: 2019-10-31
HOU, HAO-CHENG
Executed: 2019-10-31
KUO, HUNG-JUI
Executed: 2019-10-31
CHENG, JUNG-WEI
Executed: 2019-10-31
WANG, TSUNG-DING
Executed: 2019-10-31
HU, YU-HSIANG
Executed: 2019-10-31
LIAO, SIH-HAO
Executed: 2019-10-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Comprising Buffer Layer for Reducing Thermal Stress and Method of Forming the Same