IP Library Assignment 051161/0571
Patent Assignment
Reel/Frame 051161/0571

Assignment of Assignor's Interest

Recorded: 2019-12-03 Pages: 5
Assignors
LIN, YUSHENG
Executed: 2019-11-25
NOMA, TAKASHI
Executed: 2019-11-28
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Fanout Wafer Level Package for Optical Devices and Related Methods
Application: 16/701,533 →
Publication: US 2021/0167112
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Oct 16, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054090/0617 →
Release of Security Interest in Patents Recorded at Reel 054090, Frame 0617 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064081/0167 →