Patent Assignment
Reel/Frame 051164/0587
Assignment of Assignor's Interest
Recorded: 2019-12-03
Pages: 7
Assignors
THOMASON, MICHAEL
Executed: 2018-07-30
QUDDUS, MOHAMMED T.
Executed: 2018-07-27
MUDHOLKAR, MIHIR
Executed: 2018-08-02
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Method for Forming Trench Semiconductor Device Having Schottky Barrier Structure
Application:
16/701,933 →
Publication:
US 2020/0105877
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Oct 16, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054090/0617 →
Release of Security Interest in Patents Recorded at Reel 054090, Frame 0617
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064081/0167 →