Patent Assignment
Reel/Frame 051187/0495
Assignment of Assignor's Interest
Recorded: 2019-12-05
Pages: 5
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Dual Metal Capped via Contact Structures for Semiconductor Devices
Patent:
10,964,792 →
Application:
16/692,127 →