Patent Assignment
Reel/Frame 051190/0837
Assignment of Assignor's Interest
Recorded: 2019-12-05
Pages: 6
Assignors
HARADA, SHIGENORI
Executed: 2019-11-18
MATSUZAWA, MINORU
Executed: 2019-11-13
KIUCHI, HAYATO
Executed: 2019-11-13
YODO, YOSHIAKI
Executed: 2019-11-14
ARAKAWA, TARO
Executed: 2019-11-13
AGARI, MASAMITSU
Executed: 2019-11-13
KAWAMURA, EMIKO
Executed: 2019-11-13
FUJII, YUSUKE
Executed: 2019-11-13
MIYAI, TOSHIKI
Executed: 2019-11-13
OHMAE, MAKIKO
Executed: 2019-11-13
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Processing Method Using a Ring Frame with a Polyester Sheet with No Adhesive Layer