Patent Assignment
Reel/Frame 051209/0799
Assignment of Assignor's Interest
Recorded: 2019-12-05
Pages: 8
Assignors
YANG, JULIE
Executed: 2019-10-15
WU, CHII-MING
Executed: 2019-11-17
TSAI, TZU-CHUNG
Executed: 2019-10-16
CHANG, YAO-WEN
Executed: 2019-10-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Film Structure for Bond Pad