Assignment of Assignor's Interest

Recorded: 2019-12-13 Pages: 10

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Assignors

KIM, JUNGAH

Executed: 2019-10-17

PARK, MIHYUN

Executed: 2019-10-17

LEE, JINWOO

Executed: 2019-12-11

KIM, KEONYOUNG

Executed: 2019-10-17

LEE, HYOSAN

Executed: 2019-10-17

HAN, HOON

Executed: 2019-10-17

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Etching Composition, a Method of Etching a Metal Barrier Layer and a Metal Layer Using the Same, and Method of Manufacturing Semiconductor Device Using the Same

Patent: 11,028,488 →

Application: 16/574,372 →

Publication: US 2020/0087798

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.

Assignment of Assignor's Interest Dec 13, 2019

From: LEE, JIN UK; LIM, JUNG HUN

To: SOULBRAIN CO., LTD.

Reel/Frame 051273/0159 →