IP Library Assignment 051280/0893
Patent Assignment
Reel/Frame 051280/0893

Assignment of Assignor's Interest

Recorded: 2019-12-13 Pages: 9
Assignors
LEE, BONGYONG
Executed: 2019-11-19
CHOI, DOOJIN
Executed: 2019-11-19
PARK, KYEONGSEOK
Executed: 2019-11-19
YANG, JEONGWOO
Executed: 2019-11-19
KANG, BOHEE
Executed: 2019-12-13
NEYER, THOMAS
Executed: 2019-12-09
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Power Device Including Metal Layer
Application: 16/714,249 →
Publication: US 2021/0183788
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Oct 16, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054090/0617 →
Release of Security Interest in Patents Recorded at Reel 054090, Frame 0617 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064081/0167 →