IP Library Assignment 051310/0519
Patent Assignment
Reel/Frame 051310/0519

Assignment of Assignor's Interest

Recorded: 2019-12-17 Pages: 14
Assignors
XIAO, LI
Executed: 2019-06-04
XUAN, MINGHUA
Executed: 2019-06-04
ZHAO, DETAO
Executed: 2019-06-04
CHEN, HAO
Executed: 2019-06-04
CHEN, LIANG
Executed: 2019-06-04
LIU, DONGNI
Executed: 2019-06-04
Assignee
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property (1)
Array Substrate with via Hole Structures, Manufacturing Method Thereof and Display Device
Application: 16/701,706 →
Publication: US 2020/0286921
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 27, 2022
From: BOE TECHNOLOGY GROUP CO., LTD.
To: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Reel/Frame 060826/0252 →