Patent Assignment
Reel/Frame 051316/0389
Assignment of Assignor's Interest
Recorded: 2019-12-18
Pages: 11
Assignors
AHMED, RAJU
Executed: 2019-12-17
KEWLEY, DAVID A.
Executed: 2019-12-17
PRATT, DAVE
Executed: 2019-12-17
SUNG, YUNG-TA
Executed: 2019-12-17
SPEETJENS, FRANK
Executed: 2019-12-17
LUGANI, GURPREET
Executed: 2019-12-17
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1- 525, BOISE, IDAHO, 83716
Covered Property
(1)
Conductive Interconnects and Methods of Forming Conductive Interconnects