Patent Assignment
Reel/Frame 051326/0513
Assignment of Assignor's Interest
Recorded: 2019-12-18
Pages: 6
Assignors
CHENG, JUNG-WEI
Executed: 2019-11-19
LEE, CHIEN-HSUN
Executed: 2019-11-19
YU, CHI-YANG
Executed: 2019-11-19
HOU, HAO-CHENG
Executed: 2019-11-19
PAN, HSIN-YU
Executed: 2019-11-19
WANG, TSUNG-DING
Executed: 2019-11-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof