IP Library › Assignment 051372/0875
Patent Assignment
Reel/Frame 051372/0875

Assignment of Assignor's Interest

Recorded: 2019-12-26 Pages: 2
Assignors
NAITO, SHIGEKI
Executed: 2019-01-08
UEYAMA, YOSHIO
Executed: 2019-01-08
Assignee
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
1-61, SHIROMI 2-CHOME, CHUO-KU, OSAKA-SHI, OSAKA, 540-6207, JAPAN
Covered Property (1)
Adhesive for Heat Press Molding, Wooden Board, and Manufacturing Methods Thereof
Application: 16/486,829 →
Publication: US 2020/0190366
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Mar 17, 2026
From: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 075166/0563 →
Nunc Pro Tunc Assignment Mar 17, 2026
From: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
To: PANASONIC HOUSING SOLUTIONS CO., LTD.
Reel/Frame 075144/0149 →