Patent Assignment
Reel/Frame 051406/0909
Assignment of Assignor's Interest
Recorded: 2020-01-03
Pages: 7
Assignors
ST. GERMAIN, STEPHEN
Executed: 2019-12-19
LIN, YUSHENG
Executed: 2020-01-02
CHEW, CHEE HIONG
Executed: 2019-12-20
PRAJUCKAMOL, ATAPOL
Executed: 2019-12-20
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Low Stress Asymmetric Dual Side Module
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 13, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 052656/0842 →
Release of Security Interest in Patents Recorded at Reel 052656, Frame 0842
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064080/0149 →