Patent Assignment
Reel/Frame 051422/0215
Assignment of Assignor's Interest
Recorded: 2020-01-06
Pages: 10
Assignors
WANG, QIANG
Executed: 2020-01-02
CARRERA, MARIANNA
Executed: 2020-01-02
HU, KAN
Executed: 2019-12-24
CHEN, HAIBO
Executed: 2019-12-27
POPPER, AMBROISE
Executed: 2019-12-26
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Software Framework and Development Platform for Wi-Fi Chipsets
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Oct 16, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054090/0617 →
Release of Security Interest
May 2, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 063516/0756 →
Assignment of Assignor's Interest
May 8, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: MAXLINEAR, INC.
Reel/Frame 063572/0701 →
Release of Security Interest in Patents Recorded at Reel 054090, Frame 0617
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064081/0167 →