IP Library › Assignment 051443/0496
Patent Assignment
Reel/Frame 051443/0496

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2020-01-08 Received: 2020-01-08 Pages: 13
Assignor
STATS CHIPPAC PTE. LTD.
Executed: 2019-11-28
Assignee
JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
NO. 500 LINJIANG ROAD, YUECHENG DISTRICT, SHAOXING, CNX, CHINA
Covered Applications (2)
Semiconductor Device and Method of Forming Double-Sided Fan-Out Wafer Level Package
App. No. 16/570,049
→
Semiconductor Device and Method of Forming Encapsulated Wafer Level Chip Scale Package (EWLCSP)
App. No. 16/558,135
→