Patent Assignment
Reel/Frame 051455/0070
Assignment of Assignor's Interest
Recorded: 2020-01-08
Pages: 11
Assignors
CABAHUG, ELSIE
Executed: 2016-10-24
QUINONES, MARIA CLEMENS YPIL
Executed: 2016-10-24
ESTACIO, MARIA CRISTINA
Executed: 2016-10-24
MANATAD, ROMEL NOGAS
Executed: 2016-10-24
WU, CHUNG-LIN
Executed: 2016-10-24
TEYSSEYRE, JEROME
Executed: 2016-10-24
Assignee
FAIRCHILD SEMICONDUCTOR CORPORATION
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Substrate Interposer on a Leadframe
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 13, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 052656/0842 →
Assignment of Assignor's Interest
Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest
Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
Security Interest
Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
Release of Security Interest in Patents Recorded at Reel 058871, Frame 0799
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →
Release of Security Interest in Patents Recorded at Reel 052656, Frame 0842
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064080/0149 →