Patent Assignment
Reel/Frame 051509/0703
Assignment of Assignor's Interest
Recorded: 2020-01-14
Pages: 7
Assignors
LEE, WOOJIN
Executed: 2019-12-03
SHIN, JUNGHOO
Executed: 2019-12-03
AHN, SANGHOON
Executed: 2019-12-03
LIM, JUNHYUK
Executed: 2019-12-03
KIM, DAEHAN
Executed: 2019-12-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same