Patent Assignment
Reel/Frame 051574/0061
Assignment of Assignor's Interest
Recorded: 2020-01-21
Pages: 11
Assignors
LIU, YUN
Executed: 2019-02-14
LEE, YUHUA
Executed: 2019-06-13
KU, CHENGSHENG
Executed: 2020-01-10
LIU, CHINGMING
Executed: 2019-02-01
ZHU, MENGMING
Executed: 2019-02-22
GOLUBOVIC, DUSAN
Executed: 2019-02-02
HUANG, YU JIE
Executed: 2019-02-14
Assignee
KONINKLIJKE PHILIPS N.V.
HIGH TECH CAMPUS 5, EINDHOVEN, 5656 AE, NETHERLANDS
Covered Property
(1)
Molded Package and Method of Manufacture
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.