Patent Assignment
Reel/Frame 051694/0854
Assignment of Assignor's Interest
Recorded: 2020-02-02
Pages: 5
Assignor
KUROSAKI TECHNOLOGIES, LLC
Executed: 2019-11-26
Assignee
INTELLECTUAL VENTURES ASSETS 158 LLC
251 LITTLE FALLS DRIVE, WILMINGTON, DELAWARE, 19808
Covered Property
(1)
Method for Forming Bump and Semiconductor Device
Patent:
6,383,891 →
Application:
09/284,616 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 15, 2009
From: NIIGATA SEIMITSU CO., LTD.
To: NSC CO, LTD.
Reel/Frame 023373/0610 →
Assignment of Assignor's Interest
Jan 4, 2010
From: NSC CO., LTD.
To: KUROSAKI TECHNOLOGIES, LLC
Reel/Frame 023720/0646 →
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →