IP Library Assignment 051708/0778
Patent Assignment
Reel/Frame 051708/0778

Assignment of Assignor's Interest

Recorded: 2020-01-27 Pages: 4
Assignors
TOCHIYAMA, SHIGENOBU
Executed: 2019-11-29
NAGASHIMA, YUHEI
Executed: 2019-11-11
TAMURA, MASAYOSHI
Executed: 2019-11-29
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property (1)
Heatsink, and Semiconductor Module Including the Heatsink
Application: 16/752,863 →
Publication: US 2020/0286812
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Company Split Sep 4, 2024
From: MITSUBISHI ELECTRIC CORPORATION
To: MITSUBISHI ELECTRIC MOBILITY CORPORATION
Reel/Frame 068834/0585 →