Patent Assignment
Reel/Frame 051754/0362
Assignment of Assignor's Interest
Recorded: 2020-02-07
Pages: 8
Assignors
CHEN, LIANGBIAO
Executed: 2020-02-04
LIU, YONG
Executed: 2020-02-04
CHENG, TZU-HSUAN
Executed: 2020-02-07
ST. GERMAIN, STEPHEN
Executed: 2020-02-05
ARBUTHNOT, ROGER
Executed: 2020-02-05
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Structure and Method Related to a Power Module Using a Hybrid Spacer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 13, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 052656/0842 →
Release of Security Interest in Patents Recorded at Reel 052656, Frame 0842
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064080/0149 →