Patent Assignment
Reel/Frame 051899/0337
Assignment of Assignor's Interest
Recorded: 2020-02-24
Pages: 4
Assignors
LEE, SUNGHYUP
Executed: 2019-12-09
KIM, SANGMIN
Executed: 2019-12-09
NOH, DAEYOUNG
Executed: 2019-12-09
PARK, JUNGSIK
Executed: 2019-12-09
SHIM, MNCHANG
Executed: 2019-12-09
LEE, SEUNGHOON
Executed: 2019-12-09
JUNG, HEESEOK
Executed: 2019-12-09
CHOI, SEUNGKI
Executed: 2019-12-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Arrangement Structure and Electronic Device Including Same