Patent Assignment
Reel/Frame 052014/0040
Assignment of Assignor's Interest
Recorded: 2020-03-04
Pages: 6
Assignors
CHOI, MINJUNG
Executed: 2020-02-11
SHIN, SOOHO
Executed: 2020-02-11
LEE, YEONJIN
Executed: 2020-02-11
HAN, JUNGHOON
Executed: 2020-02-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including a Thick Metal Layer and a Bump