Patent Assignment
Reel/Frame 052054/0671
Assignment of Assignor's Interest
Recorded: 2020-03-09
Pages: 3
Assignors
HWANG, JUN OH
Executed: 2020-03-04
SHIN, JAE HO
Executed: 2020-03-04
JI, YUN JE
Executed: 2020-03-04
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Rigid-Flexible Printed Circuit Board and Electronic Component Module