Patent Assignment
Reel/Frame 052103/0290
Assignment of Assignor's Interest
Recorded: 2020-03-12
Pages: 6
Assignors
MIN, FAN-YU
Executed: 2020-03-11
LEE, CHEN-HUNG
Executed: 2020-03-11
TAI, WEI-HANG
Executed: 2020-03-11
LUO, YUAN-TZUO
Executed: 2020-03-11
CHUANG, WEN-YUAN
Executed: 2020-03-11
KUO, CHUN-CHENG
Executed: 2020-03-11
KAO, CHIN-LI
Executed: 2020-03-11
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Package Structure and Method for Manufacturing the Same