IP Library › Assignment 052144/0138
Patent Assignment
Reel/Frame 052144/0138

Assignment of Assignor's Interest

Recorded: 2020-03-18 Pages: 3
Assignors
NISSINEN, TOMI PEKKA BERNHARD
Executed: 2019-11-19
CHEN, XIANRUI
Executed: 2019-11-19
QIU, JIAWEN
Executed: 2019-11-19
Assignee
NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
UNITS 515-517, 5/F, LAKESIDE 1, NO. 8 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK, SHATIN, NEW TERRITORIES, HONG KONG, HONG KONG
Covered Property (1)
Thermally-Conductive, Low Strength Backfill Material
Application: 16/799,866 →
Publication: US 2020/0377415
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 17, 2026
From: NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
To: HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED
Reel/Frame 075402/0632 →