Assignment of Assignor's Interest

Recorded: 2020-03-19 Pages: 8

Assignors

HOSOI, RYO

Executed: 2020-03-06

HONDA, TAKASHI

Executed: 2020-03-06

TAKAYAMA, SEIICHI

Executed: 2020-03-06

CHAN, SIK FUN

Executed: 2020-03-17

LEE, TAI BOON

Executed: 2020-03-06

ZHOU, DAYU

Executed: 2020-03-06

Assignees

SAE MAGNETICS (H.K.) LTD.

SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T., HONG KONG, HONG KONG

HEADWAY TECHNOLOGIES, INC.

682 SOUTH HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035

Covered Property (1)

Thermally Assisted Magnetic Head, Head Gimbal Assembly, Hard Disk Drive and Method of Manufacturing the Thermally Assisted Magnetic Head

Patent: 10,943,613 →

Application: 16/817,705 →