Patent Assignment
Reel/Frame 052166/0509
Assignment of Assignor's Interest
Recorded: 2020-03-19
Pages: 2
Assignors
CHEN, MING-FA
Executed: 2020-03-06
YEH, SUNG-FENG
Executed: 2020-03-06
CHEN, HSIEN-WEI
Executed: 2020-03-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package-On-Package Device