Patent Assignment
Reel/Frame 052222/0780
Assignment of Assignor's Interest
Recorded: 2020-03-25
Pages: 3
Assignor
BEYNE, ERIC
Executed: 2020-01-16
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method for Packaging Semiconductor Dies