Patent Assignment
Reel/Frame 052281/0038
Assignment of Assignor's Interest
Recorded: 2020-04-01
Pages: 7
Assignors
LEE, JONGGU
Executed: 2020-03-15
KIM, SUNGHYUP
Executed: 2020-03-15
KIM, BYUNGJO
Executed: 2020-03-15
LEE, SANGHOON
Executed: 2020-03-15
LEE, SUKWON
Executed: 2020-03-15
CHOI, SEBIN
Executed: 2020-03-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Bonding Head Including a Thermal Compensator, Die Bonding Apparatus Including the Same and Method of Manufacturing Semiconductor Package Using the Same