Patent Assignment
Reel/Frame 052293/0686
Assignment of Assignor's Interest
Recorded: 2020-04-02
Pages: 3
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST., NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Dual-Die Semiconductor Package and Manufacturing Method Thereof