IP Library › Assignment 052470/0314
Patent Assignment
Reel/Frame 052470/0314

Assignment of Assignor's Interest

Recorded: 2020-04-22 Pages: 4
Assignors
ALBERS, SVEN
Executed: 2016-01-25
REINGRUBER, KLAUS
Executed: 2016-01-25
SEIDEMANN, GEORG
Executed: 2020-01-25
GEISSLER, CHRISTIAN
Executed: 2020-01-25
PATTEN, RICHARD
Executed: 2016-01-25
Assignee
INTEL IP CORPORATION
220 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Wafer Level Package Structure with Internal Conductive Layer
Application: 15/776,051 →
Publication: US 2018/0358317
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 9, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 057254/0415 →
Assignment of Assignor's Interest Aug 2, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 057060/0431 →