Patent Assignment
Reel/Frame 052475/0319
Assignment of Assignor's Interest
Recorded: 2020-04-23
Pages: 5
Assignors
HARADA, SHIGENORI
Executed: 2020-03-30
YODO, YOSHIAKI
Executed: 2020-04-06
WATANABE, KOJI
Executed: 2020-04-14
ZHAO, JINYAN
Executed: 2020-03-31
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Stacked Wafer Processing Method