Patent Assignment
Reel/Frame 052489/0260
Assignment of Assignor's Interest
Recorded: 2020-04-24
Pages: 8
Assignors
VAN DER SIJDE, ARJEN GERBEN
Executed: 2018-03-28
PFEFFER, NICOLA BETTINA
Executed: 2018-04-11
MORAN, BRENDAN JUDE
Executed: 2018-04-02
Assignee
LUMILEDS LLC
370 W TRIMBLE RD, SAN JOSE, CALIFORNIA, 95131
Covered Property
(1)
Method and System for Dual Stretching of Wafers for Isolated Segmented Chip Scale Packages
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Missing Application Information Previously Recorded at Reel: 052489 Frame: 0260. Assignor(S) Hereby Confirms the Assignment.
Oct 27, 2021
From: VAN DER SIJDE, ARJEN GERBEN; PFEFFER, NICOLA BETTINA; MORAN, BRENDAN JUDE
To: LUMILEDS LLC
Reel/Frame 057928/0268 →
Patent Security Agreement
Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
Security Interest
Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
Release of Security Interest
Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
Assignment of Assignor's Interest
Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →